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Lai Fung 5.65% 2023-01 USD

New bond issue: Lai Fung (HKSE:1125) issued new debt notes (XS1747539465) for 350M USD as of January 10, 2018.

Lai Fung is the property development and investment arm of the Lai Sun Group in the Mainland of China.

IssuerLai Fung
Stock (Group)HKSE:1125
Bond TypeCorporate
Maturity DateJanuary 18, 2023
Residual Duration1 year, 3 months
CurrencyUSD (United States Dollar)
Coupon TypeFixed Rate
Coupon (Yearly)5.650%
Coupon FrequencySemiannual
Minimum Lot200,000 USD
Additional Lots1,000 USD
Issue DateJanuary 18, 2018
Issued Amount350,000,000 USD
Issue Price100.000%
Maturity Price100.000%
Home ExchangeHong Kong
CountryHong Kong
RegionAsia Pacific developed

Bonds, Corporate, Financials, REIT, Asia Pacific developed, Hong Kong, USD, Fixed Rate, Income

Next Emirates NDB 2.25% 2020-01 USD