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Banff Merger Sub 8.375% 2026-09 EUR

Update! New bond issue: Banff Merger Sub issued new debt notes (XS1864418857) for 302M EUR as of August 9, 2018.

Banff Merger Sub Inc. is an American entity formed to acquire BMC Software Finance.

IssuerBanff Merger Sub
Bond TypeCorporate
CategorySenior, Callable
Maturity DateSeptember 1, 2026
Residual Duration4 years, 11 months, 9 days
CurrencyEUR (Euro)
Coupon TypeFixed Rate
Coupon (Yearly)8.375%
Coupon FrequencySemiannual
Minimum Lot100,000 EUR
Additional Lots1,000 EUR
Issue DateAugust 23, 2018
Issued Amount302,000,000 EUR
Issue Price100.000%
Maturity Price100.000%
Issuer RatingB3 (Moody's)
Bond RatingCCC+ (S&P)
Other ExchangesFrankfurt, Berlin, Stuttgart, Munich
IndustryCapital Markets
CountryUnited States
RegionAmerica developed

Bonds, Corporate, Financials, Capital Markets, America developed, United States, EUR, Fixed Rate, Income

Next Vereit 4.625% 2025-11 USD