This website uses cookies and, in some cases, third-party cookies, to improve user experience. By clicking the button or continuing to use the website you agree to the use of cookies. To find out more, including how to change your settings, see our Cookie Policy.

Banff Merger Sub 9.75% 2026-09 USD

New bond issue: Banff Merger Sub issued new debt notes (USU0663LAA62, U0663LAA6) (144A: US05988LAA61, 05988LAA6) for 1.48B USD as of August 9, 2018. Tradable at TRACE OTC as of August 9, 2018. Listed at Berlin Stock Exchange as of August 13, 2018.

Banff Merger Sub Inc. is an American entity formed to acquire BMC Software Finance.

IssuerBanff Merger Sub
Bond TypeCorporate
CategorySenior, Callable
Maturity DateSeptember 1, 2026
Residual Duration4 years, 11 months, 10 days
CurrencyUSD (United States Dollar)
Coupon TypeFixed Rate
Coupon (Yearly)9.750%
Coupon FrequencySemiannual
Minimum Lot2,000 USD
Additional Lots1,000 USD
Issue DateAugust 23, 2018
Issued Amount1,475,000,000 USD
Issue Price100.000%
Maturity Price100.000%
Issuer RatingB3 (Moody's)
Bond RatingCCC+ (S&P)
Home ExchangeTRACE
Other ExchangesBerlin
IsinUSU0663LAA62
CusipU0663LAA6
Isin 144AUS05988LAA61 (144A)
Cusip 144A05988LAA6 (144A)
IndustryCapital Markets
SectorFinancials
CountryUnited States
RegionAmerica developed


Bonds, Corporate, Financials, Capital Markets, America developed, United States, USD, Fixed Rate, Income


Next JP Morgan ZC% 2048-08 USD

investopoli.com